Track Wise

Fine Line PCBs – a photo-imaging technique for high-density interconnects

Through co-operation with the University of Oxford, UK, Trackwise has developed a very high resolution PCB capability - 50 micron (0.002") features with 25 micron (0.001") gaps. This 333dpi capability corresponds to more than 110,000 features per square inch of laminate.

The technique is based on print-and-etch techniques, using a standard dry film etch resist. This allows large areas of very fine PCBs to be manufactured on a range of laminates with higher reliability and at lower cost than alternative techniques. Tracks and gaps can be fabricated on various laminates, including regular FR4, FR5, High Tg and Flex as well as soft boards (PTFE) and ceramic substrates.

Several European programmes are under way which include complex display-driver flex interconnects with extremely demanding high-density tracks and gaps on polyamide flex laminates.

The Fine Line technique has particular application to higher-density microelectronic packaging for mobile portable electronics, particularly for telecoms applications, where functionality is at a premium. Among the key areas where this interconnect technology will help is ‘flip chip’ assembly, which is key for many applications where high-speed signal performance and packaging are demanded. This is particularly important in mobile telecoms.

The new technology allows 25um tracks and gaps to be produced reliably at lower cost than current techniques allow. It extends Trackwise’s RF capability into the millimetre waveband and addresses the needs of a wide range of microelectronic applications, from laptops to medical instruments.

For further details of Trackwise high resolution PCB capability please contact Conrad Bailey, Technical Services Manager.

Tel + 44 (0) 1684 299930
E mail: info@trackwise.co.uk

 

 

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