Track Wise

Microwave Substrates Directory

Microwave and RF Materials Product Benefits and links to manufacturers.

Please note that these comments are extracted from suppliers' brochures and other publicity material and are NOT those of Trackwise.

This directory takes considerable time and effort to produce and update. Please take the time to visit our main site before you leave.

Trackwise are leading PTFE Printed Circuit Board manufacturers.  If you are designing boards on any of these products, we would appreciate the opportunity to quote for manufacturing them!

Please click on the manufacturers name to go straight to their data.

Arlon
GE
Hitachi
Gore
Krempel
Isola
Neltec (Was Metclad)
Polyflon
Rogers
Sheldahl
Taconic

Arlon

Link: www.arlonmed.com

FoamClad 100

'low permittivity microporous polymeric core bonded to an impermeable copper-clad polymeric film coverlay that provides a low composite dielectric constant'

DiClad series

'offer a choice from the lowest dielectric constant and dissipation factor to a more highly reinforced laminate with better dimensional stability'
see also below for -PIM laminates

CuClad series

'offer a choice from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability'
'laminates are cross-plied, providing true electrical and mechanical isotropy in the XY plane, a feature unique to CuClad'

IsoClad series

'the non-woven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape'
'use long random fibres and a proprietary process to provide greater dimensional stability and better dielectric constant uniformity'

25N

'designed for performance in high frequency applications where conventional material dielectric constant and losses are inadequate for the circuitry and the high cost of PTFE substrates is prohibitive'

25FR

flame resistant (UL94 V-0) equivalent to 25N

AD Series

'combine the excellent low loss electrical properties of PTFE with the enhanced value of woven fibreglass to provide low cost laminate materials'
'AD350A - higher thermal conductivity and low CTE promote its use in high power designs'

see also below for -PIM laminates

AR Series

'AR320: the higher weight ratio of fibreglass to PTFE yields a laminate with greater dimensional stability'
'AR350/450: designed to offer dielectric constants similar to thermo set laminates with much better dielectric constant uniformity, both within a sheet and between sheets'
'AR600/1000: higher dielectric constant'
'soft substrates not sensitive to vibrational stress. This permits circuit miniaturization without requiring complicated processing or fragile handling associated with pure ceramic material'

CLTE and CLTE-LC

'a reduced Z-direction thermal expansion, improving plated through hole reliability.  It is also stable during subsequent thermal cycling'
'temperature stability simplifies circuit design and optimizes circuit performance in many microwave applications'
'thermally stable dielectric constant'
'CLTE-LC is designed to offer all of the same properties and functionality as CLTE, but, in most cases, at a reduced cost'

PIM Laminates

'DiClad 880-PIM, AD250-PIM, AD300-PIM, AD320-PIM'
'reduced passive intermodulation (PIM) laminates'
'engineered to reduce the contribution made by the base laminate to PIM loss and distortion figures'
'the result of optimising the interface between the copper and laminate...is a series of materials that demonstrate reductions in PIM of up  to 20dB compared with standard laminates'

GE

Link: www.geplastics.com

GETEK

'improved thermal and electrical properties needed for sophisticated circuitry - along with significant cost savings'

GETEK II

'laminates and prepregs offer the ideal solution for high end PCB component design'
'Lowest loss on e-glass reinforced material'
'Low z-axis expansion'
'Low moisture absorption for stable electrical and thermal properties'

GIL

GIL Technologies closed permanently on 31st Jan. 2003.

Hitachi

Link: www.hitachi-chem.co.jp

MCL-LX-67F

'transmission loss is about 30% of FR-4 and equal PTFE'

Gore

Link: www.goreelectronics.com

Krempel

Link: www.krempel.com

Akaflex

'a family of products comprising flexible and semi-flexible laminates'
'can be processed from roll to roll'

PCL

'low shrinkage polyester film'

KCL

'polyimide film'
'excellent temperature and solder resistance and good dimensional stability'

GHE

'semi-flexible base laminate'
'glass fabric impregnated with modified epoxy resin'
'improved rigidity and increased dimensional stability'


Isola

Link: www.isola-usa.com

IS640

'Next generation low loss [laminate material] for high-speed digital and RF applications
'very stable over a broad frequency and temperature range'

Gigaver 210/410


Now discontinued

Neltec (was Metclad)

Link: www.parknelco.com

N9000 Laminate system

'passive intermodulation performance up to 25% better than other non-woven or woven PTFE laminates'
'foil adhesion is 50-100% better than competitive glass reinforced PTFE laminates and 200-300% greater than ceramic loaded PTFE laminates on the market'

NY

'low glass: PTFE ratio for lowest loss applications'

NX Series

'medium glass: PTFE ratio for increased mechanical strength'

NH Series

'medium glass: PTFE ratio with ceramic added for thermal stability and Dk uniformity'

N4000-13 Series

'superior choice for high speed and low loss designs when compared to conventional epoxies, BT epoxies or thermoplastic modified epoxies'
'high Tg, together with inherent toughness, makes N4000-13 ideal for withstanding multiple thermal excursions while maintaining electrical performance'

N9000-13 RF

'combines the RF electrical performance of  PTFE with the competitive performance features of expoy
'excellent solution for cost-sensitive applications'

Polyflon

Link: www.polyflon.com

Norclad

'made from thermoplastic material PPO (polyphenylene Oxide)'
'very uniform and reproducible electrical properties, and stable over temperature'

Polyguide

'precision fabricated from highest quality, high density polyolefin'
'irradiation permanently imparts improved electrical homogeneity and mechanical toughness while significantly enhancing the temperature and chemical resistance of the material'
'electrical properties remain constant up to and beyond 18GHz'

CuFlon

'dielectric is pure PTFE'

Copper-Clad ULTEM

'made from amorphous thermoplastic material PEI (polyetherimide)'
'isotropic electrical and mechanical properties with an exceptional thermal conductivity'.


Rogers

Link: www.rogerscorporation.com/acm

All laminates have V-0 flammability rating (UL-94) with the exception of RO4003

RO3000 series

'a line of PTFE materials with mechanical properties which are the same regardless of dielectric constant'
'XY expansion coefficient matches that of Copper which allows the material to exhibit excellent dimensional stability'

RO3200 series

'laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate.'
'The RO3200 series were designed as an extension of the RO3000 series, with one distinguishing characteristic, improved mechanical stability'

RO4000 series

'Non PTFE laminates, designed for performance sensitive, high volume commercial applications'


Ultralam 2000 series

'maximises dimensional stability and minimises etch shrinkage where circuit feature registration is critical'


RT/duroid 5000 series

'microfibres randomly oriented to maximise benefits of fibre reinforcement'
'dissipation factor extends usefulness to Ku-Band and above'


RT/duroid 6000 series

'first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties'
'extremely low coefficient of dielectric constant from -55C to +150C'
'exceptional dimensional stability is achieved by matching XY coefficient of thermal expansion to that of Copper'


RT/duroid 6006/6010

'close dielectric control, nearly isotropic electrical properties and low moisture absorption'


TMM series

'electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialised production techniques'
'exceptionally low thermal coefficient of dielectric constant'

Sheldahl

Link: www.sheldahl.com

ComClad HF

'excellent electrical properties'
'especially attractive because of the combination of a dielectric constant of 2.6, a dissipation factor of 0.0025 and very low prices'
'uses a common plastic as the base dielectric so designers can form, mould, bend and even insert-mould it in a plastic injection process'

Taconic

Link: www.taconic-add.com

'our precise manufacturing process results in a laminate with a uniform thickness profile, a precise dielectric constant and a consistently low dissipation factor through the entire sheet'
'maintaining precise control provides exceptional lot-to-lot consistency'
'unique capability to manufacture base materials in sheet sizes up to 36"x116"

All laminates have V-0 flammability rating (UL-94)

Copper : R - rolled annealed C/CV/CL - electrodeposited (CL is very low profile)


TLX series

'exceptionally well controlled electrical and mechanical properties'
'dimensionally stable and exhibit virtually no moisture absorption during fabrication processes'

TLC series

'engineered to provide a cost effective substrate'
'offer far superior electrical performance compared to thermoset laminates'
'the construction of the laminate provides exceptional mechanical stability'
'other dielectric constants are available upon request'

TSM-30

'thermally stable material
'consistent performance over broad temperature and frequency ranges'

TLY series (also TLP series)

'the exceptionally low dissipation factor extends the usefulness of this product to 35GHz and above'

TLE series

'engineered to provide electrical and mechanical properties to meet the requirements of complex microwave and high speed digital applications'
'the low Z-axis CTE provides excellent plated through hole reliability'
'the low thermal expansion properties in the X and Y plane ensure reliability in surface mount applications'
'Dk exhibits minimal change over temperature'

TacLam series

'combination of fluoropolymer resin, woven fibreglass, BT epoxy and ceramic
'enhanced stiffness over PTFE-based laminates'

RF-30

'combines the benefits of woven glass reinforced fluoropolymer chemistry with the thermal, mechanical and electrical enhancements of ceramic elements'
'similarly priced as TLC-30 grade however the loss-tangent is significantly lower'

RF-35

'ultra low moisture absorption rate and low dissipation factor minimise phase shift with frequency'
'excellent copper peel strength, a critical aspect whenever rework is required'

 
If you have any comments, suggestions, or new materials that you would like added, please email us.

 

 

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