Our Capabilities
Trackwise’ unique patented manufacturing process has been developed to enable the production of multilayer, flexible printed circuits of any length. This patented* process is called Improved Harness Technology TM (IHT).
How can IHT help me?
Amphenol Trackwise’ IHT offers innovative solutions for various industries, including electric vehicles, aerospace, medical, and scientific & industrial sectors.
Over the years, we have been involved in virtually every kind of PCB challenge, and although our expertise is now focused on these key markets, we always relish new opportunities.
Lighter
up to 60% weight saving
Longer
length unlimited
Smaller
up to 70% smaller
More Repeatable
roll to roll, mechanised process
Cheaper & Easier
to assemble
More Reliable
digital design / highly automated process
DOWNLOADS
Visit our knowledge bank for certifications, materials performance data, our statements & declarations, and T&Cs
Manufacturing parameters
IHT is developed in-house at Amphenol Trackwise, and we continuously push the boundaries of what’s possible with every new project. Our current manufacturing parameters reflect what we know is achievable today. However, if your project requires something beyond these limits, we are always willing to explore ways to accommodate your needs and expand our capabilities.
The tables below shows our normal manufacturing parameters.
| Unit | Prototype | Production | Comments | |
|---|---|---|---|---|
| Layer Count (CU) max | 8 | 4 | Thickness limitations apply | |
| Max web weight | Kg | 150 | 150 | |
| Max web external diameter | mm | 500 | 500 | |
| Working panel max Length | mtr | 100 | 100 | Limited by roll weight only |
| Working panel max Width | mm | 630 | 630 | |
| Thickness Max | mm | 1 | 1 | |
| Thickness tolerance | um | +/-75 | +/-75 | |
| Surface Finish | OSP, ENIG, PdAu | OSP, ENIG, PdAu | Length limit (circuit ends only) for PdAu | |
| Base material type | Pebax, PU, PI, PEN, PET, LCP, PEEK, PEI, FEP | |||
| Stiffener material type | FR4, PI, Ni | FR4, PI, Ni | Stiffened flex, not flex-rigid | |
| Coverlay thickness max | um | 125 | 125 | Fusion bond allowing thicker CL |
| Adhesive max | um | 125 | 125 | |
| Copper thickness max | um | 210 | 105 | Also other conductor metals |
| Base Material thickness max | um | 125 | 125 | Fusion bond allowing thicker substrate |
| Base Material thickness min | um | 25 | 25 | |
| Aspect ratio | 8:1 | 6:1 | ||
| Plated aspect ratio | 8:1 | 6:1 | ||
| Inhole plating tolerance | um | +/-5 | +/-7 | |
| Min Annular ring | um | 100 | 125 | |
| Pattern to out line Positional | um | +/-25 | +/-50 | |
| Copper pattern to profile min | um | 75 | 100 | |
| Track and gap OL Plated | um | 100 | 100 | |
| Track and gap IL Non plated | um | 40 | 75 | Cu weight dependant |
| Trace pattern etch tolerance 1oz | um | +/-15 | +/-25 | |
| Laser Via Diameter min | um | 30 | 50 | |
| Laser via to pad positional | um | +/-25 | +/-25 | |
| Profile pattern v CAD | um | 5 | 5 | |
| Coverlay registration ablation | um | +/-25 | +/-50 | |
| Coverlay registration cut and bond | um | +/-100 | +/-200 | New |
| Coverlay registration cut and bond DPB | um | +/-500 | +/-1000 |
* European Patent No. 2810543, UK Patent No: GB2498994, US Patent No: US2015108084, Canada Patent No: 2862772, Brazil Patent No: BR1120140190330, China Patent No: ZL201380011859.6