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Home » Trackwise to exhibit at MCM ITP Conference 2013

Trackwise is pleased to announce that it will be attending  the MCM ITP (Materials and Components for Missiles, Innovation and Technology Partnership)  showcase event being held at Lille Grand Palais Conference Centre, Lille, Northern France, 22- 23 May 2013

http://www.mcmitp.com/conference-information/

Trackwise will be exhibiting its range of industry leading antenna and RF printed circuit boards, as well as its latest innovation – Improved Harness Technology™. A recent process innovation has extended Trackwise’s capability to the manufacture of multilayer flexible PCBs of any length (>8 metres, 300 inches). Boards of such length can be used as a high reliability, lightweight alternative to conventional wiring harnesses in high value, mass-critical applications.

If you are planning to be at the event we would be delighted to welcome you to our stand (6).