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Home » Trackwise to present at EIPC conference

Trackwise is delighted to have been invited to present on ‘A New Dimension of Flexible PCB’s’ at the EIPC 2017 Summer Conference, Solihull, Birmingham, June 1&2.

Large format PCBs have long been a specialism of  Trackwise – up to 2.4metres plated through hole and 2.8metres non plated through hole. However, a Trackwise patented process innovation has further extended its capability to the manufacture of multilayer flexible PCBs of unlimited length. The benefits of flex PCBs as a replacement to traditional wiring harnessess so as to save weight, save space and increase reliability, are well understood and are at the core of all modern electronics.  However their application has been limited due to the current maximum size.

Trackwise’ innovation has removed this limit and thus the proven benefits of multilayer Flex PCBs currently enjoyed primarliy at unit level can now be realised at subsystem and system level.

Marketed as Improved Harness Technology™, Trackwise will address the Conference highlighting some of the challenges and opportunities that this innovation presents.

For more information please go to:

Improved Harness Technology™

EIPC Summer Conference