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Home » Trackwise innovation granted US patent for flexible multilayer PCB manufacture

Trackwise is delighted to announce that its manufacturing process innovation, which enables the manufacture of flexible multilayer printed circuit boards of unlimited length, has been granted a patent in the USA under patent number 9226410.

Trackwise is marketing the application of this innovation as ‘Improved Harness Technology’. In high-value, mass-critical applications, boards of such length can be used as an alternative to traditional wiring harnesses, offering significant benefits particularly in terms of reliability, repeatability, installation times and moreover in the reduction of space and weight – up to 75% saving.

“We are delighted to have secured our IP in the US on this breakthrough process which we are confident will open significant new opportunities for the application of flexible multilayer PCBs” commented Trackwise Managing Director, Philip Johnston. “By effectively removing length limitations and the requirement for intermediate connections representing additional weight, cost and complexity as well as a source of potential unreliability, the proven benefits of multilayer flex PCBs currently enjoyed primarily at unit level can now be realised at subsystem and system level.”

This innovation is also patented in the UK under patent number 2498994.

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Improved Harness Technology